Limitations:
This simple estimator calculates only some components of the total machine time needed for a complete exposure. The factors considered are:
- Beam-On Time -- The time the beam is unblanked and writing. This is an estimate, as only a single dose value can be entered. If there are multiple doses in
your pattern, this will affect the accuracy of the estimate.
- Stage Move Time -- Estimate based only on the number of fields and chips on your wafer, and an average time per stage move. Longer or shorter stage moves will affect the accuracy.
- Alignment Time -- Enter the amount of time, in seconds, for wafer/global alignment, and for each chip on the wafer. These can vary depending on the substrate type and size, prealignment accuracy, etc. Leave 0 for no alignment. For a well pre-aligned wafer with good cross marks, estimate 120 seconds for wafer alignment, and 5 seconds for die alignment.
- Load / Unload / Calibrate Overhead -- If checked, adds 20 minutes to the estimate for wafer loading, pumpdown, system calibration, and unload.
Other Factors Not Included in this Simple Estimator:
- Column settling time, if changing EOS conditions. Changing current, same lens, add 10 minutes. Changing final
lens (4th to 5th, or 5th to 4th), add 40 minutes.
- Periodic system drift checks during your write (see: PATH)
- Shape handling overheads. If your pattern contains many tiny shapes, this can become
a significant!! In extreme cases, this can multiply your pattern write time by a factor of 2 or even 3 times!
So for patterns of many tiny shapes, such as small arrays of dots, this
time estimator can underestimate the actual time really badly!!