Die Per Wafer Calculator calculates the die per wafer including both reticle and die sizing parameters using four different stepping algorithms (die centered, side biased, top biased, or point centered).
WAFER LAYOUT
Diameter:
100 mm (4 in)
125 mm (5 in)
150 mm (6 in)
200 mm (8 in)
300 mm (12 in)
Edge Exclusion Width:
um
mm
mil
RETICLE TO DIE SPACING
Top:
um
mm
mil
Left:
um
mm
mil
Bottom:
um
mm
mil
Right:
um
mm
mil
RETICLE LAYOUT
Horizontal
Vertical
Units
Die Layout:
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Die Size:
um
mm
mil
Die Spacing:
um
mm
mil
CALCULATION
Do not step in exclusion ring
Output units:
um
mm
mil
Do not step partial reticles